SBAV99LT1G by Onsemi

SBAV99LT1G Onsemi

  • Manufacturer
    Onsemi
  • Mfg Part Number
    SBAV99LT1G
  • In Stock
    No Quantity Available
  • Lifecycle Status
    Active

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Description

RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;

We pick, pack, and dispatch all orders within 24-48 hours from order confirmation. Some parts may require additional testing to ensure the highest degree of quality.

Package Body Material: PLASTIC/EPOXY
Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED
Maximum Forward Voltage (VF): .715 V
Config: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS
Diode Type: RECTIFIER DIODE
Maximum Output Current: .215 A
Sub-Category: Rectifier Diodes
Surface Mount: YES
Terminal Finish: Matte Tin (Sn) - annealed
No. of Terminals: 3
Terminal Position: DUAL
Package Style (Meter): SMALL OUTLINE
JESD-30 Code: R-PDSO-G3
No. of Elements: 2
Package Shape: RECTANGULAR
Terminal Form: GULL WING
Maximum Operating Temperature: 150 Cel
Moisture Sensitivity Level (MSL): 1
Other Names: 2156-SBAV99LT1G-OS<br>SBAV99LT1GOSTR<br>SBAV99LT1GOSCT<br>SBAV99LT1GOSDKR<br>SBAV99LT1G-ND<br>2832-SBAV99LT1GTR<br>ONSONSSBAV99LT1G
No. of Phases: 1
Maximum Repetitive Peak Reverse Voltage: 100 V
JEDEC-95 Code: TO-236
JESD-609 Code: e3
Minimum Operating Temperature: -65 Cel
Maximum Non Repetitive Peak Forward Current: 2 A
Diode Element Material: SILICON
Maximum Power Dissipation: .225 W
Reference Standard: AEC-Q101
Peak Reflow Temperature (C): NOT SPECIFIED
Maximum Reverse Recovery Time: .006 us

Package Body Material: PLASTIC/EPOXY

Durable and cost-effective material, providing good mechanical protection and insulation.

Config: SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

This configuration allows for efficient power distribution in various applications.

Surface Mount: YES

Compatible with modern manufacturing processes, facilitating compact PCB designs.

Maximum Reverse Recovery Time: 0.006 us

Rapid recovery time enhances efficiency and reduces power losses in switching applications.

Package Shape: RECTANGULAR

Optimized shape for easy integration into circuit boards and space efficiency.

No. of Terminals: 3

Three terminals facilitate versatile connection options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small footprint allows for high-density packing on PCBs, crucial for compact devices.

Maximum Operating Temperature: 150 °C

High temperature tolerance ensures reliability in demanding environments.

Minimum Operating Temperature: -65 °C

Wide operational temperature range allows for use in diverse and extreme conditions.

Terminal Finish: Matte Tin (Sn) - annealed

Oxidation-resistant finish enhances solderability and long-term reliability.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit design and layout.

Maximum Power Dissipation: 0.225 W

Adequate power handling capability suitable for various applications without overheating.

Reference Standard: AEC-Q101

Complies with automotive quality standards, ensuring reliability in automotive applications.

Diode Type: RECTIFIER DIODE

Essential for converting AC to DC, making it ideal for power supply applications.

Maximum Forward Voltage (VF): 0.715 V

Low forward voltage drop increases efficiency in power conversion applications.

Maximum Output Current: 0.215 A

Sufficient current capacity for many consumer electronics and power applications.

Terminal Form: GULL WING

Gull wing terminal design facilitates automated assembly and improves the product's reliability.

No. of Elements: 2

A dual-element design allows for higher performance in rectifying applications.

Maximum Repetitive Peak Reverse Voltage: 100 V

High voltage handling capability makes this diode suitable for a wide range of applications.

Maximum Non-Repetitive Peak Forward Current: 2 A

Ability to handle high surge currents is crucial for applications requiring robust performance.

Diode Element Material: SILICON

Silicon materials provide excellent thermal stability and efficiency in electronic applications.

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